金属包覆聚合物球在铟衬垫上的固定化

Vinh Cao Duy, Hoang-Vu Nguyen, H. Kristiansen, M. Taklo, K. Aasmundtveit, N. Hoivik
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引用次数: 2

摘要

本文研究了在Ø5 μm金属(Au)包覆聚合物球(MPS)和铟(In)衬垫之间建立冶金键合的方法。MPS被放置在金属涂层与In发生反应的In衬垫上。采用干点胶法沉积MPS。通过加速/离心试验测量MPS与In衬垫之间的附着力。在34 nN的离心力下,剩余MPS的百分比从未热处理样品的10%增加到200℃退火样品的90%以上。这是一个强有力的迹象,表明在MPS上的金属涂层和衬垫上的In之间形成了冶金粘合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Immobilization of metal coated polymer spheres on Indium pads
This paper investigates an approach for creating a metallurgic bond between Ø5 μm metal (Au)-coated polymer spheres (MPS) and Indium (In) pads. MPS were positioned onto In pads where the metal coating reacted with the In. The MPS were deposited by dry dispensing. The adhesion force between the MPS and the In pads was measured by acceleration/centrifugal testing. Under a centrifugal force of 34 nN, the percentage of remaining MPS increased from 10 % for samples without heat treatment to more than 90 % for samples exposed to 200 °C annealing. This is a strong indication that a metallurgic bond had formed between the metal coating on the MPS and the In on the pads.
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