高温用砷化镓器件的最新进展

J. Wurfl
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引用次数: 8

摘要

综述了砷化镓高温电子器件和集成电路的研究进展。从GaAs的高温相关材料特性和相关异质结构开始,确定了GaAs基高温器件的关键问题,并讨论了最新的解决方案。这包括,例如,高温稳定金属化,衬底泄漏减少技术和其他主题。基于这些结果,介绍并比较了用于高温应用的最重要的晶体管技术(mesfet、hfet、hemt、jfet和hbt)。本文最后简要回顾了在高温下工作的模拟和微波集成电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent advances in GaAs devices for use at high temperatures
A review of technologies for GaAs high temperature electronic devices and integrated circuits is presented. Starting with the high temperature related material properties of GaAs and related heterostructures, key issues for GaAs-based high temperature devices are identified and state of the art solutions are discussed. This includes, for example, high temperature stable metallizations, technologies for substrate leakage reduction and other topics. Based on these results, the most important transistor technologies for high temperature applications (MESFETs, HFETs, HEMTs, JFETs and HBTs) are introduced and compared. The paper closes with a short review of analogue and microwave integrated circuits operating at high temperatures.
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