选择性快速热MOCVD法单步生长埋地InP层

O. Kreinin, G. Bahir
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引用次数: 1

摘要

快速热MOCVD工艺被用于研究InP在[001]InP衬底上的选择性生长,使用离子注入的无掩膜定义进行选择性外延。InP在未植入区生长的选择性受TMIn分压控制,可在植入区达到完全生长抑制。我们使用快速热MOCVD系统的组合特性来演示两个额外的步骤:(a)离子注入损伤区域的原位退火和(b) Fe:InP层在初级“掩膜表面”上的重新生长,以在单一生长序列中产生埋藏层。展示了高横向分辨率和高质量的未掺杂和掺铁半绝缘InP层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Single step growth of buried InP layer using selective rapid thermal MOCVD
Rapid thermal MOCVD process has been used to study the selective growth of InP on [001] InP substrate using an ion implanted mask-less definition for the selective epitaxy. The selectivity of InP growth on the un-implanted area is controlled by the TMIn partial pressure and can reach complete growth inhibition on the implanted area. We used the combined nature of the rapid thermal MOCVD system to demonstrate two additional steps: (a) in situ annealing of the ion implanted damaged area and (b) re-growth of Fe:InP layers on the primary "masked surface", to produce a buried layer in a single growth sequence. High lateral resolution and high quality un-doped and Fe doped semi-insulated InP layers are demonstrated.
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