低姿态的硅光子封装方法，具有可配置的多个电和光连接

8th IEEE International Conference on Group IV Photonics Pub Date : 2011-11-01 DOI:10.1109/GROUP4.2011.6053822

J. V. Galán, T. Tekin, G. B. Preve, A. Brimont, M. Llopis, P. Sanchis

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引用次数: 0

摘要

提出了一种具有多输入输出光栅光接口的硅光子集成电路封装方案，并进行了实验验证。该方法基于使用子组件子安装载体来保持封装中光纤的标准兼容横向方向。

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Low profile silicon photonics packaging approach featuring configurable multiple electrical and optical connectivity

A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.

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8th IEEE International Conference on Group IV Photonics

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