{"title":"传输线脉冲动态闭锁研究及皮秒成像电路分析[CMOS IC闭锁]","authors":"F. Stellari, A. Weger, P. Song, M. McManus","doi":"10.1109/ESSDER.2004.1356525","DOIUrl":null,"url":null,"abstract":"In this work, we present a methodology based on the combination of transmission line pulse (TLP) stimulation and picosecond imaging circuit analysis (PICA) for studying the dynamic onset of latchup. A mathematical model, based on carrier recombination equations, is also discussed and is shown to be in very good agreement with experimental data.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dynamic latchup study using transmission line pulses and picosecond imaging circuit analysis [CMOS IC latchup]\",\"authors\":\"F. Stellari, A. Weger, P. Song, M. McManus\",\"doi\":\"10.1109/ESSDER.2004.1356525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we present a methodology based on the combination of transmission line pulse (TLP) stimulation and picosecond imaging circuit analysis (PICA) for studying the dynamic onset of latchup. A mathematical model, based on carrier recombination equations, is also discussed and is shown to be in very good agreement with experimental data.\",\"PeriodicalId\":287103,\"journal\":{\"name\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDER.2004.1356525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDER.2004.1356525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dynamic latchup study using transmission line pulses and picosecond imaging circuit analysis [CMOS IC latchup]
In this work, we present a methodology based on the combination of transmission line pulse (TLP) stimulation and picosecond imaging circuit analysis (PICA) for studying the dynamic onset of latchup. A mathematical model, based on carrier recombination equations, is also discussed and is shown to be in very good agreement with experimental data.