T. Tanemura, Y. Higuchi, T. Kusakabe, K. Sugano, T. Tsuchiya, O. Tabata
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Contact potential difference for sequential assembly and face alignment of submillimeter components
We demonstrated a new approach utilizing contact potential difference (CPD) based self-assembly for a future sequential assembly of nano/micro components and face alignment of submillimeter scale components. Two types of experiments realized by CPD were carried out; 1) sequential assembly of silica particles using Coulomb force induced by contacting a silver (Ag) probe on a platinum (Pt) substrate, and 2) face alignment of component with Ag on one face and Pt on the other face on a Pt substrate by CPD induced additional electrostatic adhesive energy. In the face alignment experiment, the measured adhesive energies of two different metal pairs (Pt-Ag and Pt-Pt) were one order smaller than the theoretical value. However, 83 % components were successfully aligned as Pt face up.
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