Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, S. Sunter, Yung-Fa Chou, D. Kwai
{"title":"三维集成电路中tsv的小延迟测试","authors":"Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, S. Sunter, Yung-Fa Chou, D. Kwai","doi":"10.1145/2228360.2228546","DOIUrl":null,"url":null,"abstract":"In this work, we present a robust small delay test scheme for through-silicon vias (TSVs) in a 3D IC. By changing the output inverter's threshold of a TSV in a testable oscillation ring structure, we can approximate the propagation delay across that TSV, and thereby detecting a small delay fault. SPICE simulation reveals that this Variable Output Thresholding (VOT) technique is still effective even when there is significant process variation in detecting a slow TSV with some resistive open defect that may escape the traditional at-speed test.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"59","resultStr":"{\"title\":\"Small delay testing for TSVs in 3-D ICs\",\"authors\":\"Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, S. Sunter, Yung-Fa Chou, D. Kwai\",\"doi\":\"10.1145/2228360.2228546\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we present a robust small delay test scheme for through-silicon vias (TSVs) in a 3D IC. By changing the output inverter's threshold of a TSV in a testable oscillation ring structure, we can approximate the propagation delay across that TSV, and thereby detecting a small delay fault. SPICE simulation reveals that this Variable Output Thresholding (VOT) technique is still effective even when there is significant process variation in detecting a slow TSV with some resistive open defect that may escape the traditional at-speed test.\",\"PeriodicalId\":263599,\"journal\":{\"name\":\"DAC Design Automation Conference 2012\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"59\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"DAC Design Automation Conference 2012\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2228360.2228546\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"DAC Design Automation Conference 2012","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2228360.2228546","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this work, we present a robust small delay test scheme for through-silicon vias (TSVs) in a 3D IC. By changing the output inverter's threshold of a TSV in a testable oscillation ring structure, we can approximate the propagation delay across that TSV, and thereby detecting a small delay fault. SPICE simulation reveals that this Variable Output Thresholding (VOT) technique is still effective even when there is significant process variation in detecting a slow TSV with some resistive open defect that may escape the traditional at-speed test.