{"title":"Clock tree synthesis with methodology of re-use in 3D IC","authors":"Fu-Wei Chen, TingTing Hwang","doi":"10.1145/2567668","DOIUrl":"https://doi.org/10.1145/2567668","url":null,"abstract":"IP reuse methodology has been used extensively in SoC (System on Chip) design. In this reuse methodology, while design and implementation cost is saved, manufacturing cost is not. To further reduce the cost, this reuse concept has been proposed at mask and die level in three-dimension integrated circuit (3D IC). In order to achieve manufacturing reuse, in this paper, we propose a new methodology to design a global clock tree in 3D IC. The objective is to extend an existing clock tree in 2D IC to 3D IC taking into consideration the wirelength, clock skew and the number of TSVs. Compared with NNG-based method, our proposed method reduces the wirelength of the new die and skew of the global 3D clock tree, on an average, 47.16% and 5.85%, respectively.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133961125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Michael Gester, D. Müller, T. Nieberg, Christian Panten, C. Schulte, J. Vygen
{"title":"Algorithms and data structures for fast and good VLSI routing","authors":"Michael Gester, D. Müller, T. Nieberg, Christian Panten, C. Schulte, J. Vygen","doi":"10.1145/2442087.2442103","DOIUrl":"https://doi.org/10.1145/2442087.2442103","url":null,"abstract":"We present advanced data structures and algorithms for fast and high-quality global and detailed routing in modern technologies. Global routing is based on a combinatorial approximation scheme for min-max resource sharing. Detailed routing uses exact shortest path algorithms, based on a shape-based data structure for pin access and a two-level track-based data structure for long-distance connections. All algorithms are very fast. We demonstrate their superiority over traditional approaches by a comparison to an industrial router (on 32 nm and 22 nm chips). Our router is over two times faster, has 5% less netlength, 20% less vias, and reduces detours by more than 90%.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128866920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yoonmyung Lee, Dongmin Yoon, Yejoong Kim, D. Blaauw, D. Sylvester
{"title":"Circuit and system design guidelines for ultra-low power sensor nodes","authors":"Yoonmyung Lee, Dongmin Yoon, Yejoong Kim, D. Blaauw, D. Sylvester","doi":"10.1145/2228360.2228548","DOIUrl":"https://doi.org/10.1145/2228360.2228548","url":null,"abstract":"Designing an ultra-low power sensor node requires careful consideration of the system-level energy budget. Depending on applications, various components can dominate total energy. In this paper, we review three different system energy budget scenarios where any of the microprocessor, memory, and timer of a sensor node can dominate the energy budget. The design space and corresponding trade-offs for these three components are explored to suggest guidelines for the design of ultra-low power sensor nodes.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115487310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs","authors":"Moongon Jung, D. Pan, S. Lim","doi":"10.1145/2228360.2228419","DOIUrl":"https://doi.org/10.1145/2228360.2228419","url":null,"abstract":"In this work, we propose a fast and accurate chip/package thermo-mechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization methodology to alleviate mechanical reliability issues in 3D IC. First, we analyze the stress induced by chip/package interconnect elements, i.e., TSV, μ-bump, and package bump. Second, we explore and validate the principle of lateral and vertical linear superposition of stress tensors (LVLS), considering all chip/package elements. This linear superposition principle is utilized to perform full-chip/package-scale stress simulations and reliability analysis. Finally, we study the mechanical reliability issues in practical 3D chip/package designs including wide-I/O and block-level 3D ICs.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124850440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jeyavijayan Rajendran, Youngok Pino, O. Sinanoglu, R. Karri
{"title":"Security analysis of logic obfuscation","authors":"Jeyavijayan Rajendran, Youngok Pino, O. Sinanoglu, R. Karri","doi":"10.1145/2228360.2228377","DOIUrl":"https://doi.org/10.1145/2228360.2228377","url":null,"abstract":"Due to globalization of Integrated Circuit (IC) design flow, rogue elements in the supply chain can pirate ICs, overbuild ICs, and insert hardware trojans. EPIC [1] obfuscates the design by randomly inserting additional gates; only a correct key makes the design to produce correct outputs. We demonstrate that an attacker can decipher the obfuscated nctlist, in a time linear to the number of keys, by sensitizing the key values to the output. We then develop techniques to fix this vulnerability and make obfuscation truly exponential in the number of inserted keys.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115064154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Simultaneous flare level and flare variation minimization with dummification in EUVL","authors":"Shao-Yun Fang, Yao-Wen Chang","doi":"10.1145/2228360.2228578","DOIUrl":"https://doi.org/10.1145/2228360.2228578","url":null,"abstract":"Extreme Ultraviolet Lithography (EUVL) is one of the most promising Next Generation Lithography (NGL) technologies. Due to the surface roughness of the optical system used in EUVL, the rather high level of flare (i.e., scattered light) becomes one of the most critical issues in EUVL. In addition, the layout density non-uniformity and the flare periphery effect (the flare distribution at the periphery is much different from that in the center of a chip) also induce a large flare variation within a layout. Both of the high flare level and the large flare variation could worsen the control of critical dimension (CD) uniformity. Dummification (i.e., tiling or dummy fill) is one of the flare compensation strategies to reduce the flare level and the flare variation for the process with a clear-field mask in EUVL. However, existing dummy fill algorithms for Chemical-Mechanical Polishing (CMP) are not adequate for the flare mitigation problem in EUVL due to the flare periphery effect. This paper presents the first work that solves the flare mitigation problem in EUVL with a specific dummification algorithm flow considering global flare distribution. The dummification process is guided by dummy demand maps, which are generated by using a quasi-inverse lithography technique. In addition, an error-controlled fast flare map computation technique is proposed and integrated into our algorithm to further improve the efficiency without loss of computation accuracy. Experimental results show that our flow can effectively and efficiently reduce the flare level and the flare variation, which may contribute to the better control of CD uniformity.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116529842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A methodology for energy-quality tradeoff using imprecise hardware","authors":"Jiawei Huang, J. Lach, G. Robins","doi":"10.1145/2228360.2228450","DOIUrl":"https://doi.org/10.1145/2228360.2228450","url":null,"abstract":"Recent studies have demonstrated the potential for reducing energy consumption in integrated circuits by allowing errors during computation. While most proposed techniques for achieving this rely on voltage overscaling (VOS), this paper shows that Imprecise Hardware (IHW) with design-time structural parameters can achieve orthogonal energy-quality tradeoffs. Two IHW adders are improved and two IHW multipliers are introduced in this paper. In addition, a simulation-free error estimation technique is proposed to rapidly and accurately estimate the impact of IHW on output quality. Finally, a quality-aware energy minimization methodology is presented. To validate this methodology, experiments are conducted on two computational kernels: DOT-PRODUCT and L2-NORM - used in three applications - Leukocyte Tracker, SVM classification and K-means clustering. Results show that the Hellinger distance between estimated and simulated error distribution is within 0.05 and that the methodology enables designers to explore energy-quality tradeoffs with significant reduction in simulation complexity.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122048920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Micheli, C. Boero, C. Baj-Rossi, I. Taurino, S. Carrara
{"title":"Integrated biosensors for personalized medicine","authors":"G. Micheli, C. Boero, C. Baj-Rossi, I. Taurino, S. Carrara","doi":"10.1145/2228360.2228363","DOIUrl":"https://doi.org/10.1145/2228360.2228363","url":null,"abstract":"Biosensors are heterogenous devices, incorporating biological structures combined with electronics, optical or other readout systems. They have been developed for detecting different biomolecules and/or pathogens and represent a key technology for advanced and point-of-care diagnostics as well as patient monitoring. In this paper we present a systematic classification of biosensors described in literature, particularly focusing on nanotechnology-based sensing. Then, we present our approach to develop electrochemical biosensors for measuring metabolites and anticancer drugs, based on a platform for multiple target detection. This platform is modular and achieves a clear separation between the chemical and the electrical components, thus easing design and manufacturing. It shows superior performance thanks to the excellent properties of electron transfer and selectivity showed by enzymes immobilized on carbon nanotubes.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128367223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Is dark silicon useful? Harnessing the four horsemen of the coming dark silicon apocalypse","authors":"M. Taylor","doi":"10.1145/2228360.2228567","DOIUrl":"https://doi.org/10.1145/2228360.2228567","url":null,"abstract":"Due to the breakdown of Dennardian scaling, the percentage of a silicon chip that can switch at full frequency is dropping exponentially with each process generation. This utilization wall forces designers to ensure that, at any point in time, large fractions of their chips are effectively dark or dim silicon, i.e., either idle or significantly underclocked. As exponentially larger fractions of a chip's transistors become dark, silicon area becomes an exponentially cheaper resource relative to power and energy consumption. This shift is driving a new class of architectural techniques that “spend” area to “buy” energy efficiency. All of these techniques seek to introduce new forms of heterogeneity into the computational stack. We envision that ultimately we will see widespread use of specialized architectures that leverage these techniques in order to attain orders-of-magnitude improvements in energy efficiency. However, many of these approaches also suffer from massive increases in complexity. As a result, we will need to look towards developing pervasively specialized architectures that insulate the hardware designer and the programmer from the underlying complexity of such systems. In this paper, I discuss four key approaches - the four horsemen - that have emerged as top contenders for thriving in the dark silicon age. Each class carries with its virtues deep-seated restrictions that requires a careful understanding of the underlying tradeoffs and benefits.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123878386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Sudhir K. Satpathy, R. Das, R. Dreslinski, T. Mudge, D. Sylvester, D. Blaauw
{"title":"High radix self-arbitrating switch fabric with multiple arbitration schemes and quality of service","authors":"Sudhir K. Satpathy, R. Das, R. Dreslinski, T. Mudge, D. Sylvester, D. Blaauw","doi":"10.1145/2228360.2228432","DOIUrl":"https://doi.org/10.1145/2228360.2228432","url":null,"abstract":"A scalable architecture to design high radix switch fabric is presented. It uses circuit techniques to re-use existing input and output data buses and switching logic for fabric configuration and supporting multiple arbitration policies. In addition, it integrates a 4-level message-based priority arbitration for quality of service. Fine grain clock gating, tiled fabric topology and self-regenerating bit-line repeaters enable scaling the router to 8k wires. A 64×64(128b data) switch fabric fabricated in 45nm SOI CMOS spans 4.06mm2 and achieves a throughput of 4.5Tb/s at 3.4Tb/s/W at 1.1V with a peak measured efficiency of 7.4Tb/s/W at 0.6V.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116352799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}