{"title":"协同创新;信息技术发展的新杠杆","authors":"B. Meyerson","doi":"10.1109/HOTCHIPS.2006.7477866","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation on collaborative innovation and its impact on information technology development. Some of the specific topics discussed include: the economics of collaborative technology development; CMOS scaling and processing capabilities; scaling performance, 2003 versus 2006; performance evaluation of processors with and without scaling; design considerations; power and thermal management; and key factors that will impact innovation in this field.","PeriodicalId":302249,"journal":{"name":"2006 IEEE Hot Chips 18 Symposium (HCS)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Collaborative innovation; a new lever in information technology development\",\"authors\":\"B. Meyerson\",\"doi\":\"10.1109/HOTCHIPS.2006.7477866\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article consists of a collection of slides from the author's conference presentation on collaborative innovation and its impact on information technology development. Some of the specific topics discussed include: the economics of collaborative technology development; CMOS scaling and processing capabilities; scaling performance, 2003 versus 2006; performance evaluation of processors with and without scaling; design considerations; power and thermal management; and key factors that will impact innovation in this field.\",\"PeriodicalId\":302249,\"journal\":{\"name\":\"2006 IEEE Hot Chips 18 Symposium (HCS)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE Hot Chips 18 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2006.7477866\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE Hot Chips 18 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2006.7477866","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Collaborative innovation; a new lever in information technology development
This article consists of a collection of slides from the author's conference presentation on collaborative innovation and its impact on information technology development. Some of the specific topics discussed include: the economics of collaborative technology development; CMOS scaling and processing capabilities; scaling performance, 2003 versus 2006; performance evaluation of processors with and without scaling; design considerations; power and thermal management; and key factors that will impact innovation in this field.