{"title":"铝微处理器稳态传热分析","authors":"Y. Joshi, D. Ikhar","doi":"10.1109/I2CT.2017.8226232","DOIUrl":null,"url":null,"abstract":"The advanced process and higher profile works rapidly increasing the load on microprocessor and heat evolving per unit area. The paper involves the steady state heat transfer analysis of aluminium heat sink and the graphite metal heat sink. Both heat sink has put under the same physical condition and temperature profile. Modeling and Analysis has carried out by using the steady state heat transfer (SSHT) based software, ANSYS. Obtained results has been compared to determine and proving the best heat sink among them. Result has gotten by analytical and software with manual calculation. Optimization for the both heat sink has done to find out suitable heat sink with such microprocessor.","PeriodicalId":343232,"journal":{"name":"2017 2nd International Conference for Convergence in Technology (I2CT)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Steady state heat transfer analysis of aluminium microprocessors\",\"authors\":\"Y. Joshi, D. Ikhar\",\"doi\":\"10.1109/I2CT.2017.8226232\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The advanced process and higher profile works rapidly increasing the load on microprocessor and heat evolving per unit area. The paper involves the steady state heat transfer analysis of aluminium heat sink and the graphite metal heat sink. Both heat sink has put under the same physical condition and temperature profile. Modeling and Analysis has carried out by using the steady state heat transfer (SSHT) based software, ANSYS. Obtained results has been compared to determine and proving the best heat sink among them. Result has gotten by analytical and software with manual calculation. Optimization for the both heat sink has done to find out suitable heat sink with such microprocessor.\",\"PeriodicalId\":343232,\"journal\":{\"name\":\"2017 2nd International Conference for Convergence in Technology (I2CT)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 2nd International Conference for Convergence in Technology (I2CT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/I2CT.2017.8226232\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd International Conference for Convergence in Technology (I2CT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/I2CT.2017.8226232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Steady state heat transfer analysis of aluminium microprocessors
The advanced process and higher profile works rapidly increasing the load on microprocessor and heat evolving per unit area. The paper involves the steady state heat transfer analysis of aluminium heat sink and the graphite metal heat sink. Both heat sink has put under the same physical condition and temperature profile. Modeling and Analysis has carried out by using the steady state heat transfer (SSHT) based software, ANSYS. Obtained results has been compared to determine and proving the best heat sink among them. Result has gotten by analytical and software with manual calculation. Optimization for the both heat sink has done to find out suitable heat sink with such microprocessor.
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