{"title":"用有限元法分析某电子外壳的振动","authors":"M. Zampino","doi":"10.1109/SOUTHC.1995.516125","DOIUrl":null,"url":null,"abstract":"Finite element analysis is used to predict the response of a rectangular box electronic enclosure and PWB to a random vibration load. Comparison of results is made for different modeling methodologies, including the effects of mesh size and mass distribution techniques.","PeriodicalId":341055,"journal":{"name":"Proceedings of Southcon '95","volume":"503 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Vibration analysis of an electronic enclosure using finite element analysis\",\"authors\":\"M. Zampino\",\"doi\":\"10.1109/SOUTHC.1995.516125\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Finite element analysis is used to predict the response of a rectangular box electronic enclosure and PWB to a random vibration load. Comparison of results is made for different modeling methodologies, including the effects of mesh size and mass distribution techniques.\",\"PeriodicalId\":341055,\"journal\":{\"name\":\"Proceedings of Southcon '95\",\"volume\":\"503 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Southcon '95\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOUTHC.1995.516125\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Southcon '95","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1995.516125","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Vibration analysis of an electronic enclosure using finite element analysis
Finite element analysis is used to predict the response of a rectangular box electronic enclosure and PWB to a random vibration load. Comparison of results is made for different modeling methodologies, including the effects of mesh size and mass distribution techniques.