搜索高发射率薄膜增强功率半导体器件锁定热成像的定位能力

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984828

N. Chinone, T. Matsumoto, K. Koshikawa

{"title":"搜索高发射率薄膜增强功率半导体器件锁定热成像的定位能力","authors":"N. Chinone, T. Matsumoto, K. Koshikawa","doi":"10.1109/IPFA47161.2019.8984828","DOIUrl":null,"url":null,"abstract":"We will demonstrate the capability of lock-in thermography (LIT) for fault localization in a packaged power semiconductor device by using high-emissivity film. Different types of films were investigated to explore suitable type of film for LIT. Pasting the selected film on the heatsink of a packaged device increased the signal-to-noise ratio of LIT analysis, which enhanced the nondestructive localization ability of LIT.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"312 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancement of localization capability of lock-in thermography for power semiconductor devices by searching high-emissivity films\",\"authors\":\"N. Chinone, T. Matsumoto, K. Koshikawa\",\"doi\":\"10.1109/IPFA47161.2019.8984828\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We will demonstrate the capability of lock-in thermography (LIT) for fault localization in a packaged power semiconductor device by using high-emissivity film. Different types of films were investigated to explore suitable type of film for LIT. Pasting the selected film on the heatsink of a packaged device increased the signal-to-noise ratio of LIT analysis, which enhanced the nondestructive localization ability of LIT.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"312 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984828\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984828","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

我们将展示锁相热成像(LIT)在封装功率半导体器件中使用高发射率薄膜进行故障定位的能力。研究了不同类型的薄膜，以探索适合于LIT的薄膜类型。将选定的薄膜粘贴在封装器件的散热器上，提高了LIT分析的信噪比，从而增强了LIT的无损定位能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Enhancement of localization capability of lock-in thermography for power semiconductor devices by searching high-emissivity films

We will demonstrate the capability of lock-in thermography (LIT) for fault localization in a packaged power semiconductor device by using high-emissivity film. Different types of films were investigated to explore suitable type of film for LIT. Pasting the selected film on the heatsink of a packaged device increased the signal-to-noise ratio of LIT analysis, which enhanced the nondestructive localization ability of LIT.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量