35nm mHEMT技术,适用于太赫兹和超低噪声应用

A. Leuther, A. Tessmann, M. Dammann, H. Massler, M. Schlechtweg, O. Ambacher
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引用次数: 57

摘要

在本文中,我们提出了一个非常紧凑的0.28 × 0.55 mm2的六级太赫兹单片集成电路(TMIC),该电路使用35 nm栅长变形高电子迁移率晶体管(mHEMTs)。在漏极电压Vd仅为0.6 V的情况下,在610 GHz时实现了20.3 dB的线性增益,在557至616 GHz的带宽范围内实现了超过18 dB的线性增益。在封装的h波段放大器的基础上,研究了35 nm mHEMT的噪声性能,该放大器在220 ~ 300 GHz之间实现了超过20 dB的小信号增益。平均测量噪声系数为6.1 dB,据我们所知,这是该频率范围内任何MMIC技术的最低公布值。为了确定晶体管的可靠性,在空气中进行了加速寿命试验。基于20% gm_max的降解失效准则,外推了通道温度为75℃,VDS = 0.8 V时的中位失效时间为1.8 × 105 h
本文章由计算机程序翻译,如有差异,请以英文原文为准。
35 nm mHEMT Technology for THz and ultra low noise applications
In this paper we present a very compact 0.28 × 0.55 mm2 six-stage terahertz monolithic integrated circuit (TMIC) using 35 nm gate length metamorphic high electron mobility transistors (mHEMTs). A linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz was achieved for a drain voltage Vd of only 0.6 V. The noise performance of the 35 nm mHEMT was investigated on the basis of a packaged H-band amplifier which achieved a small-signal gain of more than 20 dB between 220 and 300 GHz. The averaged measured noise figure was 6.1 dB which is to our knowledge the lowest published value of any MMIC technology in this frequency range. To determine the transistor reliability accelerated lifetime tests in air were done. Based on a 20 % gm_max degradation failure criterion a median time to failure of 1.8 × 105 h at a channel temperature of 75°C and VDS = 0.8 V was extrapolated
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