H. Pomp, P. Woerlee, R. Woltjer, G. Paulzen, H. Lifka, A. Kuiper, J. D. de Zaldivar, S. Vecsernyes
{"title":"在传统电炉中生长的轻N/sub 2/O氮化电介质,用于E/sup 2/PROM和0.25 /spl μ m CMOS","authors":"H. Pomp, P. Woerlee, R. Woltjer, G. Paulzen, H. Lifka, A. Kuiper, J. D. de Zaldivar, S. Vecsernyes","doi":"10.1109/IEDM.1993.347310","DOIUrl":null,"url":null,"abstract":"For deep-submicron CMOS transistors and FLOTOX E/sup 2/PROM devices a considerable improvement in reliability and performance can be achieved when nitrided dielectrics are used. We developed an N/sup 2/O nitridation technology for a conventional furnace. Oxidation and nitridation are done in one run with a two-step and low-thermal budget processing to grow a dielectric layer with a thickness of 6-10 nm.<<ETX>>","PeriodicalId":346650,"journal":{"name":"Proceedings of IEEE International Electron Devices Meeting","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Lightly N/sub 2/O nitrided dielectrics grown in a conventional furnace for E/sup 2/PROM and 0.25 /spl mu/m CMOS\",\"authors\":\"H. Pomp, P. Woerlee, R. Woltjer, G. Paulzen, H. Lifka, A. Kuiper, J. D. de Zaldivar, S. Vecsernyes\",\"doi\":\"10.1109/IEDM.1993.347310\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For deep-submicron CMOS transistors and FLOTOX E/sup 2/PROM devices a considerable improvement in reliability and performance can be achieved when nitrided dielectrics are used. We developed an N/sup 2/O nitridation technology for a conventional furnace. Oxidation and nitridation are done in one run with a two-step and low-thermal budget processing to grow a dielectric layer with a thickness of 6-10 nm.<<ETX>>\",\"PeriodicalId\":346650,\"journal\":{\"name\":\"Proceedings of IEEE International Electron Devices Meeting\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.1993.347310\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1993.347310","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Lightly N/sub 2/O nitrided dielectrics grown in a conventional furnace for E/sup 2/PROM and 0.25 /spl mu/m CMOS
For deep-submicron CMOS transistors and FLOTOX E/sup 2/PROM devices a considerable improvement in reliability and performance can be achieved when nitrided dielectrics are used. We developed an N/sup 2/O nitridation technology for a conventional furnace. Oxidation and nitridation are done in one run with a two-step and low-thermal budget processing to grow a dielectric layer with a thickness of 6-10 nm.<>