增强和耗尽模式pHEMT采用6英寸GaAs具有成本效益的生产工艺

Y. Hsieh, T. Hwang, T. Yeh, C. Yuan, C.J. Chen, P. Yeh, J.H. Hwang, C.-H. Chen, C. Wu
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引用次数: 7

摘要

采用0.5/spl μ l /m门长光学步进pHEMT技术,在6英寸GaAs晶圆上展示了一种具有成本效益的增强/耗尽模式pHEMT MMIC工艺。在这种工艺简化中,e模和d模栅极同时沉积。e模pHEMT在室温下的引脚电压为+0.22V(定义为0.1mA/mm),最大外部跨导为400mS/mm。在V/sub - gs/=0V和V/sub - ds/=3V时,e型器件的断态电流通常为0.15/spl mu/A/mm。该电流极低,适用于功耗最小的高密度数字电路。另一方面,d模pHEMT的引脚电压为-0.75V,跨导为370mS/mm。由于优化的光栅光刻和前端工艺产生的优异的DC/RF特性和良好的E/D phemt均匀性,D模式开关和E模式数字控制电路构成了WLAN和手机应用中射频控制电路的单片解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhancement and depletion-mode pHEMT using 6 inch GaAs cost-effective production process
A cost effective enhancement/depletion mode pHEMT MMIC process on 6-inch GaAs wafer is demonstrated by using 0.5/spl mu/m gate-length optical stepper pHEMT technology. E-mode and D-mode gates are deposited simultaneously in this process simplification. The E-mode pHEMT exhibits a pinch-off voltage of +0.22V (defined at 0.1mA/mm), and a maximum extrinsic transconductance of 400mS/mm at room temperature. The off-state current of E-mode device is typically 0.15/spl mu/A/mm at V/sub gs/=0V and V/sub ds/=3V. This current is extreme low and is suitable for high density digital circuits with minimized power consumption. On the other hand, a pinch-off voltage of -0.75V and a transconductance of 370mS/mm has been measured for D-mode pHEMT. Due to excellent DC/RF characteristics and good uniformity of E/D pHEMTs from optimized optical gate lithography and front-side process, the D-mode switch and E-mode digital control circuit constitute a monolithic solution to RF control circuits in WLAN and cell phone applications.
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