柔性和刚性印刷电路板的区域分布焊接

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122219

W. Clark, W. Pelosi

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引用次数: 2

摘要

描述了一种新颖的设计/工艺，该设计/工艺便于以可检查和可维修的方式将柔性印刷电路区域分布焊接到电路封装。在设计中，在刚性印刷电路板上的表面贴装焊盘和柔性印刷电路上的镀通孔之间形成焊点。通过将柔性印刷电路和印刷电路板加热到回流温度，然后允许沉积在表面安装垫上的焊料通过镀通孔上升，从而形成接头。由于焊锡通过镀通孔上升到柔性印刷电路的外表面，因此球形焊锡帽清晰可见且可检查。焊点也很容易修复，因为柔性印刷电路可以重新加热以回流一个或所有的焊点。讨论了AT&T产品中采用区域分布焊接柔性的两种连接器设计。

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Area-distributed-soldering of flexible and rigid printed circuit boards

A novel design/process is described which facilitates area-distributed soldering of a flexible-printed-circuit to a circuit pack in an inspectable and repairable manner. In the design, solder joints are formed between surface-mount pads on a rigid printed-circuit-board and plated-through-holes on a flexible-printed-circuit. The joints are formed by heating both the flexible-printed-circuit and the printed-circuit-board to reflow temperatures and then allowing solder which has been deposited on the surface mount pads to rise through the plated-through-holes. Because solder rises up through the plated-through-holes to the exterior surface of the flexible-printed-circuit, spherical solder caps are clearly visible and inspectable. Solder joints are also easily repaired since the flexible-printed-circuit can be reheated to reflow one or all the solder joints. Two connector designs being used in AT&T products which employ area-distributed soldering of flex are discussed.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量