Z. Tao, Hong-Xia Liu, Qianwei Kuang, Nai-Qiong Cai, H. Yue, Zhao Aaron, Tallavarjula Sai
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Physical and structural properties of HfO2/SiO2 gate stack high-k dielectrics deposited by atomic layer deposition
The ultra-thin HfO2/SiO2 gate stack high-k dielectrics were deposited by Atomic Layer Deposition. The physical and structural properties of the HfO2/SiO2 films were investigated. Atomic force microscopy, transmission electron microscopy and x-ray reflectivity analysis results indicate that the atomic layer deposition can deposit HfO2/SiO2 gate stack dielectrics with good performance.