O. Haberlen, M. Polzl, J. Schoiswohl, M. Rosch, S. Léomant, G. Nobauer, W. Rieger
{"title":"采用新型沟槽功率MOSFET双沟道结构,实现95%的DC-DC转换效率,降低体二极管损耗","authors":"O. Haberlen, M. Polzl, J. Schoiswohl, M. Rosch, S. Léomant, G. Nobauer, W. Rieger","doi":"10.1109/ISPSD.2015.7123390","DOIUrl":null,"url":null,"abstract":"A novel 25V silicon trench power MOSFET optimized for fast and high efficient switching with record Ron*Qg and Ron*Qoss figure-of-merits is reported. A dual channel structure with two different gate oxide thicknesses allows reducing the body diode conduction losses by up to 50% and enables 95% DC-DC conversion efficiency.","PeriodicalId":289196,"journal":{"name":"2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"95% DC-DC conversion efficiency by novel trench power MOSFET with dual channel structure to cut body diode losses\",\"authors\":\"O. Haberlen, M. Polzl, J. Schoiswohl, M. Rosch, S. Léomant, G. Nobauer, W. Rieger\",\"doi\":\"10.1109/ISPSD.2015.7123390\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel 25V silicon trench power MOSFET optimized for fast and high efficient switching with record Ron*Qg and Ron*Qoss figure-of-merits is reported. A dual channel structure with two different gate oxide thicknesses allows reducing the body diode conduction losses by up to 50% and enables 95% DC-DC conversion efficiency.\",\"PeriodicalId\":289196,\"journal\":{\"name\":\"2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2015.7123390\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2015.7123390","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
95% DC-DC conversion efficiency by novel trench power MOSFET with dual channel structure to cut body diode losses
A novel 25V silicon trench power MOSFET optimized for fast and high efficient switching with record Ron*Qg and Ron*Qoss figure-of-merits is reported. A dual channel structure with two different gate oxide thicknesses allows reducing the body diode conduction losses by up to 50% and enables 95% DC-DC conversion efficiency.