基于紧凑电流模型的栅极氧化物击穿导致的SRAM可靠性退化建模

Rui Zhang, Taizhi Liu, Kexin Yang, L. Milor
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引用次数: 5

摘要

栅极氧化物击穿(GOBD)会降低ram的性能。本文采用一种紧凑的电流模型实现了由于GOBD引起的SRAM可靠性退化的建模方法。在考虑占空比分布和工艺变化的情况下,通过蒙特卡罗模拟获得SRAM寿命。我们分析了SRAM单元在不同应力下的寿命分布和失效概率,发现占空比分布接近50%的数据缓存失效概率较低。此外,还研究了纠错码(ECC)的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling for SRAM reliability degradation due to gate oxide breakdown with a compact current model
Gate oxide breakdown (GOBD) degrades the performance of SRAMs. In this paper, a modeling methodology for SRAM reliability degradation due to GOBD is implemented with a compact current model. SRAM lifetime is obtained from Monte Carlo simulations while considering the duty cycle distribution and process variations. We analyzed the lifetime distribution and failure probability of SRAM cells under different stress, and found that the data cache with a duty cycle distribution closer to 50% has a lower failure probability. Moreover, the effect of Error Correcting Codes (ECC) is also studied.
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