面板级扇出封装可靠性制造

{"title":"面板级扇出封装可靠性制造","authors":"T. Braun, O. Hölck","doi":"10.1007/978-3-030-81576-9_16","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":269519,"journal":{"name":"Reliability of Organic Compounds in Microelectronics and Optoelectronics","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Manufacturing for Reliability of Panel-Level Fan-out Packages\",\"authors\":\"T. Braun, O. Hölck\",\"doi\":\"10.1007/978-3-030-81576-9_16\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":269519,\"journal\":{\"name\":\"Reliability of Organic Compounds in Microelectronics and Optoelectronics\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Reliability of Organic Compounds in Microelectronics and Optoelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-3-030-81576-9_16\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Reliability of Organic Compounds in Microelectronics and Optoelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-030-81576-9_16","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}