金属灯丝增强了热能储存，应用于高功率密度手持电子设备的按需冷却

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI:10.1109/STHERM.2010.5444311

M. Yaquinto, R. Wirtz

{"title":"金属灯丝增强了热能储存，应用于高功率密度手持电子设备的按需冷却","authors":"M. Yaquinto, R. Wirtz","doi":"10.1109/STHERM.2010.5444311","DOIUrl":null,"url":null,"abstract":"A thin-slab thermal energy storage volume with embedded metal filaments sandwiched between an electronics heat spreader plate and the hand-held unit skin is analyzed. A numerical model is created and results are compared with temperature responses of a plane 1-D pad containing no metal filaments. Results show the addition of fins reduces operating temperatures by 30% in addition to reducing the phase change material's re-solidification time by approximately 37%. Additionally, a thermal response analytical model is developed. The analytical model results correlate well against numerical simulations. A parametric study outlines the effects of the Biot number and power level impact on performance.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Metal filament enhanced thermal energy storage applied to on-demand cooling of high power-density hand-held electronics\",\"authors\":\"M. Yaquinto, R. Wirtz\",\"doi\":\"10.1109/STHERM.2010.5444311\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A thin-slab thermal energy storage volume with embedded metal filaments sandwiched between an electronics heat spreader plate and the hand-held unit skin is analyzed. A numerical model is created and results are compared with temperature responses of a plane 1-D pad containing no metal filaments. Results show the addition of fins reduces operating temperatures by 30% in addition to reducing the phase change material's re-solidification time by approximately 37%. Additionally, a thermal response analytical model is developed. The analytical model results correlate well against numerical simulations. A parametric study outlines the effects of the Biot number and power level impact on performance.\",\"PeriodicalId\":111882,\"journal\":{\"name\":\"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2010.5444311\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2010.5444311","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

分析了夹在电子散热板和手持单元外壳之间的嵌入金属细丝的薄板蓄热体。建立了数值模型，并与不含金属丝的平面一维焊盘的温度响应进行了比较。结果表明，翅片的加入使操作温度降低了30%，相变材料的再凝固时间减少了约37%。此外，还建立了热响应分析模型。解析模型结果与数值模拟结果吻合较好。参数研究概述了Biot数量和功率水平对性能的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Metal filament enhanced thermal energy storage applied to on-demand cooling of high power-density hand-held electronics

A thin-slab thermal energy storage volume with embedded metal filaments sandwiched between an electronics heat spreader plate and the hand-held unit skin is analyzed. A numerical model is created and results are compared with temperature responses of a plane 1-D pad containing no metal filaments. Results show the addition of fins reduces operating temperatures by 30% in addition to reducing the phase change material's re-solidification time by approximately 37%. Additionally, a thermal response analytical model is developed. The analytical model results correlate well against numerical simulations. A parametric study outlines the effects of the Biot number and power level impact on performance.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

自引率

0.00%

发文量