采用1µm自对准InP/InGaAs/InP DHBT带发射极台面钝化壁的120 gbit /s 520 mvpp多路复用器IC

Y. Arayashiki, Y. Ohkubo, T. Matsumoto, T. Koji, Y. Amano, A. Takagi, Y. Matsuoka
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引用次数: 3

摘要

采用1−µm自校准InP/InGaAs/InP双异质结构双极晶体管(dhbt),制备了具有重定时功能的2:1多路复用IC (MUX)。由于高性能dhbt和电路设计,我们实现了宽带阻抗匹配,在晶圆上测量时,MUX的工作速度为120 Gbit/s,功耗为1.27 W,输出幅度为520 mV。MUX在实际使用中使用v型连接器组装在一个模块中。在该模块中,MUX的工作速率为113 Gbit/s,输出幅度为514 mW,功耗为1.4 W。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 120-Gbit/s 520-mVPP multiplexer IC using 1-µm self-aligned InP/InGaAs/InP DHBT with emitter mesa passivation ledge
We fabricated 2:1 multiplexer IC (MUX) with a retiming function by using 1−µm self-aligned InP/InGaAs/InP double heterostructure bipolar transistors (DHBTs). As a result of the high performance DHBTs and the circuit design, in which we implemented broadband impedance matching, the MUX operated at 120 Gbit/s with a power dissipation of 1.27 W and an output amplitude of 520 mV when measured on the wafer. The MUX was assembled in a module using V-connectors for practical use. In this module, the MUX operated at 113 Gbit/s with an output amplitude of 514 mW and a power dissipation of 1.4 W.
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