基于NI-PXI测试平台的DALS系统温度相关故障软缺陷定位

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984866

Jed Paolo Deligente

{"title":"基于NI-PXI测试平台的DALS系统温度相关故障软缺陷定位","authors":"Jed Paolo Deligente","doi":"10.1109/IPFA47161.2019.8984866","DOIUrl":null,"url":null,"abstract":"Temperature dependent failures have always presented challenges in failure analysis of advanced mixed signal integrated circuits. Soft defect localization (SDL) has been proven a reliable fault isolation technique however, reliable capture of pass/fail signal conditions, temperature characterization and laser synchronization are vital in having an effective SDL result. This paper presents a case study which demonstrates how NI-PXI system was utilized as a test and synchronization platform with DALS module of Hamamatsu iPHEMOS.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Soft Defect Localization (SDL) of Temperature Dependent Failure using NI-PXI Test Platform in DALS System\",\"authors\":\"Jed Paolo Deligente\",\"doi\":\"10.1109/IPFA47161.2019.8984866\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Temperature dependent failures have always presented challenges in failure analysis of advanced mixed signal integrated circuits. Soft defect localization (SDL) has been proven a reliable fault isolation technique however, reliable capture of pass/fail signal conditions, temperature characterization and laser synchronization are vital in having an effective SDL result. This paper presents a case study which demonstrates how NI-PXI system was utilized as a test and synchronization platform with DALS module of Hamamatsu iPHEMOS.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984866\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984866","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

温度相关故障一直是先进混合信号集成电路失效分析的难点。软缺陷定位(SDL)已被证明是一种可靠的故障隔离技术，然而，可靠的捕获合格/失败信号条件，温度表征和激光同步对于获得有效的SDL结果至关重要。本文通过一个实例，演示了NI-PXI系统如何与滨松iphonos的DALS模块作为测试和同步平台。

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Soft Defect Localization (SDL) of Temperature Dependent Failure using NI-PXI Test Platform in DALS System

Temperature dependent failures have always presented challenges in failure analysis of advanced mixed signal integrated circuits. Soft defect localization (SDL) has been proven a reliable fault isolation technique however, reliable capture of pass/fail signal conditions, temperature characterization and laser synchronization are vital in having an effective SDL result. This paper presents a case study which demonstrates how NI-PXI system was utilized as a test and synchronization platform with DALS module of Hamamatsu iPHEMOS.

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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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