基于NI-PXI测试平台的DALS系统温度相关故障软缺陷定位

Jed Paolo Deligente
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引用次数: 0

摘要

温度相关故障一直是先进混合信号集成电路失效分析的难点。软缺陷定位(SDL)已被证明是一种可靠的故障隔离技术,然而,可靠的捕获合格/失败信号条件,温度表征和激光同步对于获得有效的SDL结果至关重要。本文通过一个实例,演示了NI-PXI系统如何与滨松iphonos的DALS模块作为测试和同步平台。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Soft Defect Localization (SDL) of Temperature Dependent Failure using NI-PXI Test Platform in DALS System
Temperature dependent failures have always presented challenges in failure analysis of advanced mixed signal integrated circuits. Soft defect localization (SDL) has been proven a reliable fault isolation technique however, reliable capture of pass/fail signal conditions, temperature characterization and laser synchronization are vital in having an effective SDL result. This paper presents a case study which demonstrates how NI-PXI system was utilized as a test and synchronization platform with DALS module of Hamamatsu iPHEMOS.
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