2.5 Gb/s高速串行接口的设计、特性和信号完整性分析

2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) Pub Date : 2015-11-12 DOI:10.1109/RTSI.2015.7325068

A. Cossettini, A. Cristofoli, W. Grollitsch, Lino Alves, R. Nonis, Luca Della Ricca, P. Palestri, L. Selmi

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引用次数: 5

摘要

设计了一种2.5 Gb/s汽车用高速串行变送器，建立了电路/封装/板集成仿真程序，实现了高速串行接口的协同设计。该仿真方法采用发射机的晶体管级模型与传输通道的物理模型相结合，因此不需要简化的行为模型。模型/硬件相关的报告，包括闭眼和抖动的影响。实验结果与模拟结果吻合良好。

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Design, characterization and signal integrity analysis of a 2.5 Gb/s High-Speed Serial Interface for automotive applications overarching the chip/PCB wall

A 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.

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来源期刊

2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI)

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