小组讨论:“未来十年的酷芯片”

2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2017-04-19 DOI:10.1109/CoolChips.2017.7946378

H. Amano, Tadao Nakamura, Hiroaki Kobayashi, H. Kasahara, Y. Hagiwara, J. Burns, D. Brash

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引用次数: 0

摘要

CMOS工艺的发展还在继续，但它的终结已经初见端倪。21纳米以下的先进制程半导体芯片价格昂贵，只能用于销售百万级产品。另一方面，先进的人工智能、物联网和大数据技术需要越来越多的计算/通信能力，而电力预算却受到严格限制。我们如何在未来十年开发出“酷芯片”?“酷芯片”会议又能做出什么贡献呢?

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Panel discussions: “Cool chips for the next decade”

The advance of CMOS process is still going, but the end is coming into sight. Semiconductor chips with advanced process later than 21nm are so expensive that they are developed only for million selling products. On the other hand, the advanced AI, IoT and big data technologies require more and more computation/communication power with a tightly limited power budget. How we can develop a “Cool chips” in the next decade? And how can the conference “Cool chips” contribute?

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2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

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