Boundary Scan Techniques in an Mcm-D Application

The development of multichip modules (MCMs) is confronted by many challenges in the area of testing. This paper details the solutions to some of these challenges which resulted in the successful development of a wafer scale, silicon-on silicon multichip module. The end product is a 4" silicon substrate mounted on a SEM-E frame. The SEM-E module was designed to perform image processing and is one of many modules making up a high performance image processing computer. Through the extensive use of boundary scan to perform both interconnect testing and functional testing, the wafer scale MCM was inserted into the target system rack and worked correctly the first time.