{"title":"基于功率集成电路器件的高能注入新技术","authors":"D. Patti, G. Franzò, V. Privitera, F. Priolo","doi":"10.1109/ISPSD.1999.764127","DOIUrl":null,"url":null,"abstract":"In this work, a significant improvement of power integrated circuit technology has been obtained by the use of high energy implantation, thus eliminating a second epitaxial growth. The damage in implanted region has been recovered by rapid thermal annealing.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"417 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new high energy implantation based technology for power integrated circuit devices\",\"authors\":\"D. Patti, G. Franzò, V. Privitera, F. Priolo\",\"doi\":\"10.1109/ISPSD.1999.764127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a significant improvement of power integrated circuit technology has been obtained by the use of high energy implantation, thus eliminating a second epitaxial growth. The damage in implanted region has been recovered by rapid thermal annealing.\",\"PeriodicalId\":352185,\"journal\":{\"name\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"volume\":\"417 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1999.764127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1999.764127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new high energy implantation based technology for power integrated circuit devices
In this work, a significant improvement of power integrated circuit technology has been obtained by the use of high energy implantation, thus eliminating a second epitaxial growth. The damage in implanted region has been recovered by rapid thermal annealing.