温度循环曲线和焊料力学性能的变化对无铅BGA封装热机械可靠性的影响

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI:10.1109/EUROSIME.2015.7103102

I. Belov, Jonas Arwidson, R. Poder, P. Johannesson, P. Leisner

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引用次数: 2

摘要

本文研究了PBGA256封装中温度循环曲线和SAC305焊料杨氏模量的变化对热机械可靠性的影响。FE模拟通过引入具有相同停留时间和周期特征的不同温度分布来量化循环减少和计数技术的效果。对于所研究的剖面，预测的每循环累积蠕变应变能密度的差异为30%。在提供的建模假设和简化下，SAC305焊点热疲劳寿命的最大变化在30%以内，这是由实验确定的交货包装中的杨氏模量变化造成的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package

The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young's modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young's modulus variation in as-delivered packages.

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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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