Physical processes in micromachining of silicon by laser /spl mu/-jet

To allow the production of small /spl mu/m order microstructures, processing with the laser /spl mu/-jet has the unique characteristics of material removal process, but its industrial application has yet to be established. This paper describes creating fine patterned microstructure in silicon using this laser /spl mu/-jet and discusses various physical phenomenon that ultimately affect the quality of the end product and explores the possibilities of current and new application areas. The present results show much better cut quality compared with the conventional technique. Grating like grove structures were created with a line and pitch width below 100 /spl mu/m.