{"title":"一种宽边耦合的无管平衡器","authors":"R. K. Settaluri, A. Weisshaar","doi":"10.1109/MWSYM.2003.1212596","DOIUrl":null,"url":null,"abstract":"This paper presents the design procedure for a new two-level vialess balun configuration. Simple design equations are reported for designing the impedance transforming balun in broadside-edge-coupled configuration. The balun is realized in a six-coupled line two-layer topology with no ground connections and interconnecting vias. The simulated results are validated by full-wave electromagnetic simulation and found to be in good agreement.","PeriodicalId":252251,"journal":{"name":"IEEE MTT-S International Microwave Symposium Digest, 2003","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A broadside-edge-coupled vialess balun\",\"authors\":\"R. K. Settaluri, A. Weisshaar\",\"doi\":\"10.1109/MWSYM.2003.1212596\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design procedure for a new two-level vialess balun configuration. Simple design equations are reported for designing the impedance transforming balun in broadside-edge-coupled configuration. The balun is realized in a six-coupled line two-layer topology with no ground connections and interconnecting vias. The simulated results are validated by full-wave electromagnetic simulation and found to be in good agreement.\",\"PeriodicalId\":252251,\"journal\":{\"name\":\"IEEE MTT-S International Microwave Symposium Digest, 2003\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-06-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE MTT-S International Microwave Symposium Digest, 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2003.1212596\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE MTT-S International Microwave Symposium Digest, 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2003.1212596","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents the design procedure for a new two-level vialess balun configuration. Simple design equations are reported for designing the impedance transforming balun in broadside-edge-coupled configuration. The balun is realized in a six-coupled line two-layer topology with no ground connections and interconnecting vias. The simulated results are validated by full-wave electromagnetic simulation and found to be in good agreement.