{"title":"用硅电路板设计混合信号mcm - d","authors":"C.R. Hodges, D. Benson, K. Huey","doi":"10.1109/MCMC.1995.512016","DOIUrl":null,"url":null,"abstract":"MCM-D technologies can be used to meet the challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact of a specific silicon circuit board based MCM-D technology on these performance parameters.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design of mixed signal MCM-Ds using silicon circuit boards\",\"authors\":\"C.R. Hodges, D. Benson, K. Huey\",\"doi\":\"10.1109/MCMC.1995.512016\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"MCM-D technologies can be used to meet the challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact of a specific silicon circuit board based MCM-D technology on these performance parameters.\",\"PeriodicalId\":223500,\"journal\":{\"name\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1995.512016\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512016","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of mixed signal MCM-Ds using silicon circuit boards
MCM-D technologies can be used to meet the challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact of a specific silicon circuit board based MCM-D technology on these performance parameters.
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