{"title":"超低功耗物联网解决方案的半导体平台","authors":"T. Dry, T. Letavic","doi":"10.23919/VLSIT.2017.7998143","DOIUrl":null,"url":null,"abstract":"Intelligent connected sensor and actuator endpoint nodes enable the Internet-of-Things (IoT). A brief overview of endpoint node functional blocks and requirements for low-power consumption are discussed. VLSI technology enablers for IoT include Ultra low Power (ULP) and Ultra Low Leakage (ULL) semiconductor process platform extensions. ULP and ULL implementations for bulk silicon technologies are presented and compared to fully-depleted silicon-on-insulator (FDSOI) technology. FDSOI utilizes Back Bias (BB) to improve performance and achieve the lowest dynamic and static power, enabling cost-effective low-power IoT applications.","PeriodicalId":176340,"journal":{"name":"2017 Symposium on VLSI Circuits","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Semiconductor platforms for ultra low power IoT solutions\",\"authors\":\"T. Dry, T. Letavic\",\"doi\":\"10.23919/VLSIT.2017.7998143\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Intelligent connected sensor and actuator endpoint nodes enable the Internet-of-Things (IoT). A brief overview of endpoint node functional blocks and requirements for low-power consumption are discussed. VLSI technology enablers for IoT include Ultra low Power (ULP) and Ultra Low Leakage (ULL) semiconductor process platform extensions. ULP and ULL implementations for bulk silicon technologies are presented and compared to fully-depleted silicon-on-insulator (FDSOI) technology. FDSOI utilizes Back Bias (BB) to improve performance and achieve the lowest dynamic and static power, enabling cost-effective low-power IoT applications.\",\"PeriodicalId\":176340,\"journal\":{\"name\":\"2017 Symposium on VLSI Circuits\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Symposium on VLSI Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSIT.2017.7998143\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSIT.2017.7998143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Semiconductor platforms for ultra low power IoT solutions
Intelligent connected sensor and actuator endpoint nodes enable the Internet-of-Things (IoT). A brief overview of endpoint node functional blocks and requirements for low-power consumption are discussed. VLSI technology enablers for IoT include Ultra low Power (ULP) and Ultra Low Leakage (ULL) semiconductor process platform extensions. ULP and ULL implementations for bulk silicon technologies are presented and compared to fully-depleted silicon-on-insulator (FDSOI) technology. FDSOI utilizes Back Bias (BB) to improve performance and achieve the lowest dynamic and static power, enabling cost-effective low-power IoT applications.
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