高失配半导体合金带间隧穿的理论分析

C. Broderick, Sarita Das, E. O’Reilly
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引用次数: 1

摘要

对改进中红外传感技术的需求推动了高信噪比光电二极管的发展。实现这一目标的关键是将暗电流最小化,而带对带隧道(BTBT)在窄间隙材料中发挥了重要作用。本文从理论上分析了窄间隙稀氮半导体合金中BTBT的电流密度,并评价了氮掺入对BTBT电流密度的影响。对于低场强,我们的计算表明,利用n相关的带抗交叉对复杂带结构(CBS)的影响,有可能降低BTBT。在高场下,我们的分析表明,BTBT是由N掺入对CBS的影响和态的导带边缘密度之间的相互作用决定的,并且近似等于传统窄隙材料中的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Theoretical analysis of band-to-band tunneling in highly-mismatched semiconductor alloys
The requirement for improved mid-infrared sensing technologies motivates the development of photodiodes displaying high signal-to-noise ratio. Key to achieving this goal is minimisation of the dark current, to which band-to-band tunneling (BTBT) contributes significantly in narrow-gap materials. We present a theoretical analysis of BTBT in narrow-gap dilute nitride semiconductor alloys, and evaluate the impact of nitrogen (N) incorporation on the BTBT current density. For low field strengths our calculations suggest the potential to reduce BTBT by exploiting the impact of N-related band-anticrossing on the complex band structure (CBS). At high fields our analysis suggests that BTBT is governed by an interplay between the impact of N incorporation on the CBS and on the conduction band edge density of states, and is approximately equal to that in a conventional narrow-gap material.
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