HBM封装集成:技术趋势、挑战和应用

2016 IEEE Hot Chips 28 Symposium (HCS) Pub Date : 2016-08-01 DOI:10.1109/HOTCHIPS.2016.7936172

S. Ramalingam

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引用次数: 14

摘要

Tb/s低延迟带宽和较低的系统功耗正在推动对HBM采用的需求，矽介层(2.5D)是选择的现有技术。潜在的低成本，细间距互连晶圆级和基于基板的技术正在出现，为了推动HBM应用(冷却限制)和更高性能堆栈(8-Hi)的广泛采用，需要支持更高的HBM结温(>95C)

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HBM package integration: Technology trends, challenges and applications

❯ Tb/s low latency bandwidth and lower system power is driving the need for HBM adoption ❯ Silicon Interposer (2.5D) is the incumbent technology of choice. Potentially lower cost, fine pitch interconnect wafer-level and substrate based technologies are emerging ❯ To drive broader adoption of HBM applications (cooling limited) and higher performance stacks (8-Hi), higher HBM junction temperature (>95C) needs to be supported

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来源期刊

2016 IEEE Hot Chips 28 Symposium (HCS)

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