用于功率应用的GaAs HBT[功率放大器应用]

O. Berger
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引用次数: 5

摘要

TriQuint HBT工艺基于InGaP/GaAs,发射器长度为2 /spl mu/m或3 /spl mu/m。新型HBT3的直流电流增益设置为130,击穿电压BVcbo、BVceo和BVbeo分别为24 V、14 V和7 V。40 GHz和65 GHz的F/sub T/和F/sub max/非常适合从蜂窝频段到802.11a/b/g频率的手持市场和WLAN业务。1.9 GHz的功率密度为0.3 mW//spl mu/m/sup 2/,用于当前的功率放大器。GaAs HBT模块的成本已被证明比基于SiGe的模块更具成本效益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GaAs HBT for power applications [power amplifier applications]
The TriQuint HBT process is based on InGaP/GaAs with 2 /spl mu/m or 3 /spl mu/m emitter lengths. The DC current gain for the new HBT3 is set to 130, breakdown voltages BVcbo, BVceo and BVbeo are 24 V, 14 V, and 7 V, respectively. F/sub T/ and F/sub max/ of 40 GHz and 65 GHz are ideally suited for the hand-set market and WLAN business from cellular bands to 802.11a/b/g frequencies. Power densities at 1.9 GHz of 0.3 mW//spl mu/m/sup 2/ are used in current power amplifiers. The cost of GaAs HBT modules has been proven to be more cost effective than SiGe based modules.
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