在基于HfO2的RRAM设备中,底部和顶部接口在第一次复位操作中的作用

E. Pérez, M. K. Mahadevaiah, C. Zambelli, P. Olivo, C. Wenger
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引用次数: 6

摘要

本文研究了基于HfO2的1T1R RRAM器件在第一次复位操作中,采用带验证算法的增量步进脉冲对导电丝电导率的增加。提出了一种新的方法,通过强调金属-氧化物界面所起的关键作用来解释电导率的增加。顶部金属-氧化物界面(HfO2−x/TixOy)在形成过程中起着至关重要的作用,它在氧化铪层中产生了很强的氧空位梯度。底部的金属氧化物界面(TixOyNz/HfO2−x)也产生了氧空位,这在第一次复位开始时加强了该界面附近的导电丝尖端,导致报告的电导率增加。在第一次复位操作后,导电灯丝稳定在底部界面,抑制了随后复位操作中的这种行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The role of the bottom and top interfaces in the 1st reset operation in HfO2 based RRAM devices
In this work, the increase on the conductive filament conductivity during the 1st Reset operation, by using the incremental step pulse with verify algorithm, in HfO2 based 1T1R RRAM devices is investigated. A new approach is proposed in order to explain the increase of conductivity by highlighting the crucial roles played by both metal-oxide interfaces. The top metal-oxide interface (HfO2−x/TixOy) plays a crucial role in the forming operation by creating a strong gradient of oxygen vacancies in the hafnium oxide layer. The bottom metal-oxide interface (TixOyNz/HfO2−x) also creates oxygen vacancies, which strengthen the conductive filament tip near to this interface at the beginning of the 1st Reset, leading to the reported conductivity increase. After the 1st Reset operation the conductive filament stabilizes at the bottom interface suppressing this behavior in the subsequent reset operations.
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