{"title":"先进高速设计的阻抗特性保证了信号完整性","authors":"A. Amédéo, C. Gautier, F. Costa, Laurent Bernard","doi":"10.1109/EMCZUR.2009.4783437","DOIUrl":null,"url":null,"abstract":"It is increasingly important to use Controlled Impedance for manufacturing High-Speed and High Density-Interconnect (HDI) Printed Circuit Board (PCB). Furthermore, signal integrity (SI) tools are required to prevent and reduce most of impedance mismatch and crosstalk problems. This paper presents the impedance characterization of PCB traces, created in an industrial context. From the first specifications to Time domain Reflectometer (TDR) measurements in PCB, we describe the differences between calculated impedances in layer stack, coupon and micro-section analysis. Besides, the impact of Net geometry on characteristic impedance is evaluated through both 2D and 3D simulations.","PeriodicalId":192851,"journal":{"name":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Signal Integrity Ensured Through Impedance Characterization of Advanced High-Speed Design\",\"authors\":\"A. Amédéo, C. Gautier, F. Costa, Laurent Bernard\",\"doi\":\"10.1109/EMCZUR.2009.4783437\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is increasingly important to use Controlled Impedance for manufacturing High-Speed and High Density-Interconnect (HDI) Printed Circuit Board (PCB). Furthermore, signal integrity (SI) tools are required to prevent and reduce most of impedance mismatch and crosstalk problems. This paper presents the impedance characterization of PCB traces, created in an industrial context. From the first specifications to Time domain Reflectometer (TDR) measurements in PCB, we describe the differences between calculated impedances in layer stack, coupon and micro-section analysis. Besides, the impact of Net geometry on characteristic impedance is evaluated through both 2D and 3D simulations.\",\"PeriodicalId\":192851,\"journal\":{\"name\":\"2009 20th International Zurich Symposium on Electromagnetic Compatibility\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 20th International Zurich Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCZUR.2009.4783437\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 20th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2009.4783437","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Signal Integrity Ensured Through Impedance Characterization of Advanced High-Speed Design
It is increasingly important to use Controlled Impedance for manufacturing High-Speed and High Density-Interconnect (HDI) Printed Circuit Board (PCB). Furthermore, signal integrity (SI) tools are required to prevent and reduce most of impedance mismatch and crosstalk problems. This paper presents the impedance characterization of PCB traces, created in an industrial context. From the first specifications to Time domain Reflectometer (TDR) measurements in PCB, we describe the differences between calculated impedances in layer stack, coupon and micro-section analysis. Besides, the impact of Net geometry on characteristic impedance is evaluated through both 2D and 3D simulations.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
