通过NBTI和HCI效应处理基于可靠性的木马

Y. Shiyanovskii, F. Wolff, Aravind Rajendran, C. Papachristou, D. Weyer, W. Clay
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引用次数: 87

摘要

在本文中,我们引入了基于过程可靠性的木马的概念,这些木马通过恶意改变制造工艺条件来降低集成电路的可靠性。与分别改变IC电路或功能的硬件/软件木马相反,过程可靠性木马是由于制造过程步骤的改变而出现的。可靠性的降低是由于CMOS晶体管的磨损机制加速引起的,例如负偏置温度不稳定性(NBTI)或热载流子注入(HCI)。微小的制造工艺更改可能导致产生寿命短得多且难以检测的受感染ic。这种受感染的ic过早失效,并可能导致灾难性后果。本文描述了NBTI和HCI机制的可能的过程更改,这些更改可能导致过程可靠性木马的创建。本文还探讨了一些可能的检测技术,可以帮助识别隐藏的木马,并讨论了基于过程可靠性的木马导致严重损害的各种情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process reliability based trojans through NBTI and HCI effects
In this paper, we introduce the notion of process reliability based trojans which reduce the reliability of integrated circuits through malicious alterations of the manufacturing process conditions. In contrast to hardware/software trojans which either alter the circuitry or functionality of the IC respectively, the process reliability trojans appear as a result of alterations in the fabrication process steps. The reduction in reliability is caused by acceleration of the wearing out mechanisms for CMOS transistors, such as Negative Bias Temperature Instability (NBTI) or Hot Carrier Injection (HCI). The minor manufacturing process changes can result in creation of infected ICs with a much shorter lifetime that are difficult to detect. Such infected ICs fail prematurely and might lead to catastrophic consequences. The paper describes possible process alterations for both NBTI and HCI mechanisms that might result in creation of process reliability trojans. The paper also explores some possible detection techniques that can help identify the hidden trojans and discusses the various scenarios when process reliability based trojans lead to severe damages.
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