{"title":"陶瓷片电容器分层的无损x射线检测","authors":"R. Spriggs, A. Cronshagen","doi":"10.1109/IRPS.1976.362736","DOIUrl":null,"url":null,"abstract":"A radiographic method has been devised and successfully applied to the detection of delaminations in small ceramic-chip capacitors. The results indicate that this nondestructive technique is suitable for sampling or 100% screening of lots. The radiograph provides an integrated image of internal structure rather than a view of just one plane as in cross sectioning. It requires proper alignment of chips in the x-ray beam, and readily detects voids of at least 0.001-inch width that extend more than 30% of the depth of the capacitor. Life tests of radiographically graded parts showed a high correlation with physical-sectioning results and with capacitor failure rates.","PeriodicalId":428300,"journal":{"name":"14th International Reliability Physics Symposium","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Nondestructive, X-Ray Inspection of Ceramic-Chip Capacitors for Delaminations\",\"authors\":\"R. Spriggs, A. Cronshagen\",\"doi\":\"10.1109/IRPS.1976.362736\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A radiographic method has been devised and successfully applied to the detection of delaminations in small ceramic-chip capacitors. The results indicate that this nondestructive technique is suitable for sampling or 100% screening of lots. The radiograph provides an integrated image of internal structure rather than a view of just one plane as in cross sectioning. It requires proper alignment of chips in the x-ray beam, and readily detects voids of at least 0.001-inch width that extend more than 30% of the depth of the capacitor. Life tests of radiographically graded parts showed a high correlation with physical-sectioning results and with capacitor failure rates.\",\"PeriodicalId\":428300,\"journal\":{\"name\":\"14th International Reliability Physics Symposium\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1976-04-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"14th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1976.362736\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"14th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1976.362736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nondestructive, X-Ray Inspection of Ceramic-Chip Capacitors for Delaminations
A radiographic method has been devised and successfully applied to the detection of delaminations in small ceramic-chip capacitors. The results indicate that this nondestructive technique is suitable for sampling or 100% screening of lots. The radiograph provides an integrated image of internal structure rather than a view of just one plane as in cross sectioning. It requires proper alignment of chips in the x-ray beam, and readily detects voids of at least 0.001-inch width that extend more than 30% of the depth of the capacitor. Life tests of radiographically graded parts showed a high correlation with physical-sectioning results and with capacitor failure rates.