陶瓷片电容器分层的无损x射线检测

R. Spriggs, A. Cronshagen
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引用次数: 10

摘要

本文设计了一种射线照相方法,并成功地应用于小型陶瓷片电容器的分层检测。结果表明,该技术适用于样品取样或100%筛选。x光片提供了内部结构的整体图像,而不是像横切面那样只是一个平面的视图。它要求芯片在x射线束中正确对齐,并且很容易检测到宽度至少为0.001英寸、延伸超过电容器深度30%的空隙。射线照相分级部件的寿命试验显示与物理切片结果和电容器故障率高度相关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nondestructive, X-Ray Inspection of Ceramic-Chip Capacitors for Delaminations
A radiographic method has been devised and successfully applied to the detection of delaminations in small ceramic-chip capacitors. The results indicate that this nondestructive technique is suitable for sampling or 100% screening of lots. The radiograph provides an integrated image of internal structure rather than a view of just one plane as in cross sectioning. It requires proper alignment of chips in the x-ray beam, and readily detects voids of at least 0.001-inch width that extend more than 30% of the depth of the capacitor. Life tests of radiographically graded parts showed a high correlation with physical-sectioning results and with capacitor failure rates.
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