{"title":"用于VLSI可靠性分析的集成热载流子退化模拟器","authors":"Y. Leblebici, S. Kang","doi":"10.1109/ICCAD.1990.129936","DOIUrl":null,"url":null,"abstract":"A novel integrated simulation tool is presented for estimating the hot-carrier induced degradation of nMOS transistor characteristics and circuit performance. The proposed reliability simulation tool incorporates an accurate one-dimensional MOSFET model for representing the electrical behavior of locally damaged transistors. The hot-carrier induced oxide damage can be specified by only a few parameters, avoiding extensive parameter extractions for the characterization of device damage. The physical degradation model used in the simulation tool includes both of the fundamental device degradation mechanisms, i.e., charge trapping and interface trap generation. A repetitive simulation scheme has been adopted to ensure accurate prediction of the circuit-level degradation process under dynamic operating conditions. The simulation tool provides information on the evolution of device degradation during long-term operation, and on the performance characteristics of the damaged circuit.<<ETX>>","PeriodicalId":242666,"journal":{"name":"1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":"{\"title\":\"An integrated hot-carrier degradation simulator for VLSI reliability analysis\",\"authors\":\"Y. Leblebici, S. Kang\",\"doi\":\"10.1109/ICCAD.1990.129936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel integrated simulation tool is presented for estimating the hot-carrier induced degradation of nMOS transistor characteristics and circuit performance. The proposed reliability simulation tool incorporates an accurate one-dimensional MOSFET model for representing the electrical behavior of locally damaged transistors. The hot-carrier induced oxide damage can be specified by only a few parameters, avoiding extensive parameter extractions for the characterization of device damage. The physical degradation model used in the simulation tool includes both of the fundamental device degradation mechanisms, i.e., charge trapping and interface trap generation. A repetitive simulation scheme has been adopted to ensure accurate prediction of the circuit-level degradation process under dynamic operating conditions. The simulation tool provides information on the evolution of device degradation during long-term operation, and on the performance characteristics of the damaged circuit.<<ETX>>\",\"PeriodicalId\":242666,\"journal\":{\"name\":\"1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-11-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"23\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1990.129936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1990.129936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An integrated hot-carrier degradation simulator for VLSI reliability analysis
A novel integrated simulation tool is presented for estimating the hot-carrier induced degradation of nMOS transistor characteristics and circuit performance. The proposed reliability simulation tool incorporates an accurate one-dimensional MOSFET model for representing the electrical behavior of locally damaged transistors. The hot-carrier induced oxide damage can be specified by only a few parameters, avoiding extensive parameter extractions for the characterization of device damage. The physical degradation model used in the simulation tool includes both of the fundamental device degradation mechanisms, i.e., charge trapping and interface trap generation. A repetitive simulation scheme has been adopted to ensure accurate prediction of the circuit-level degradation process under dynamic operating conditions. The simulation tool provides information on the evolution of device degradation during long-term operation, and on the performance characteristics of the damaged circuit.<>