用于VLSI可靠性分析的集成热载流子退化模拟器

Y. Leblebici, S. Kang
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引用次数: 23

摘要

提出了一种新的集成仿真工具,用于估计热载子引起的nMOS晶体管特性和电路性能的退化。提出的可靠性仿真工具包含一个精确的一维MOSFET模型来表示局部损坏晶体管的电学行为。热载流子诱导的氧化损伤可以只用几个参数来指定,避免了大量的参数提取来表征器件损伤。仿真工具中使用的物理退化模型包括两个基本的器件退化机制,即电荷捕获和界面陷阱的产生。为了准确预测动态运行条件下的电路级退化过程,采用了重复仿真方案。该仿真工具提供了在长期运行过程中器件退化演变的信息,以及损坏电路的性能特征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An integrated hot-carrier degradation simulator for VLSI reliability analysis
A novel integrated simulation tool is presented for estimating the hot-carrier induced degradation of nMOS transistor characteristics and circuit performance. The proposed reliability simulation tool incorporates an accurate one-dimensional MOSFET model for representing the electrical behavior of locally damaged transistors. The hot-carrier induced oxide damage can be specified by only a few parameters, avoiding extensive parameter extractions for the characterization of device damage. The physical degradation model used in the simulation tool includes both of the fundamental device degradation mechanisms, i.e., charge trapping and interface trap generation. A repetitive simulation scheme has been adopted to ensure accurate prediction of the circuit-level degradation process under dynamic operating conditions. The simulation tool provides information on the evolution of device degradation during long-term operation, and on the performance characteristics of the damaged circuit.<>
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