Henry Chen, Jimmy Chang, Sheng-Tsung Tsao, Junjun Zhang, Jie Du, Congcong Fan, Alex Huang, David Xu, Sam Liu, Liang Wu, Kimi Yang, Ning Gu, L. Ren, Jian Wu, A. Tan, Sunny Xia, Ivan Mao
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Real time process monitoring using diffraction-based overlay measurements from YieldStar
Real-time process monitoring (RTPM) is a method for semiconductor manufacturing monitoring and tuning using a physical prediction model. It is a fast and nondestructive process excursion measurement method which takes inputs from diffraction-based overlay measurements from YieldStar. The prediction model is created by a physical model which receives standard manufacturing information as input. The prediction capability has been validated in a manufacturing environment experiment with thin film thickness prediction difference less than 3%.
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