Y. Kwon, Hewei Liu, Soongyu Yi, H. Bian, Feng Chen, Zongfu Yu, Hongrui Jiang
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Sub-10-nanometer-scale laser ablation on hard materials from dielectric near-field nanophotonics
This paper demonstrates sub-10-nanometer (nm) laser ablation on hard materials. An 800-nm-wavelength femtosecond laser is focused down to sub-diffraction-limited scale by a silicon nanophotonic structure fabricated on a silicon-on-isolator (SOI) substrate, which is utilized to enable the ablation on the silicon dioxide (SiO2) layer of the SOI. Atomic force microscopy (AFM) results show a minimum ablation linewidth of about 8 nm with a depth-to-width ratio close to 1.
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