热电冷却器中的物理过程

L. Bulat, E.V. Buzin, U. S. Whang
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引用次数: 1

摘要

使用热电制冷方法是冷却芯片和其他电子元件的最佳实用方法之一。电子元件的小型化要求热电冷却器的小型化。现代热电冷却器的厚度可达微米级。在这种情况下,所有的半导体热电输运规律都变得不正确。本文提出了一种微型热电冷却器的热电理论。新的非线性效应导致热输运方程和电输运方程的变化。在这种条件下,导出了所有动力学系数和热电优值的非线性解析公式。理论表明,在典型情况下,非线性效应会导致热电优值和COP的增加。这样的结果与已知的实验数据不一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical processes in thermoelectric coolers
A usage of the thermoelectric method of refrigeration is one of the best practical methods of cooling chips and other electronic components. The miniaturization of electronic elements requires the miniaturization of thermoelectric coolers for such electronics. Modern thermoelectric coolers may have a thickness of microns. Under these conditions, all transport regulations of thermoelectricity in semiconductors become incorrect. In the present paper a thermoelectric theory of microminiaturized thermoelectric coolers is proposed. The new nonlinear effects result in changing of all equations for heat and electric transport. Nonlinear analytical formulas for all kinetic coefficients and for thermoelectric figure of merit under such conditions have been derived. The theory shows that, in typical cases, the nonlinear effects could lead to an increase of the thermoelectric figure of merit and COP. Such a result is inconsistent with known experimental data.
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