MCM中的小间距Tab-lsi互连技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639808

F. Mori, K. Kudo, K. Tsukamoto

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引用次数: 0

摘要

对超级计算机和大型主机更高处理速度的追求使得高密度封装技术变得极其重要。作者开发了一种新技术，可以使用TAB (Tape Automated Bonding)将多引脚(487引脚)超快速逻辑lsi连接到110 μm的陶瓷基板上。通过开发新材料、粘合工艺和制造设备，作者能够实现比传统技术更精细的连接间距。因此，他们能够开发出一种超细间距、高密度和高可靠性的封装技术，使他们能够生产高性能计算机系统

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fine Pitch Tab-lsi Interconnection Technology In MCM

The quest for higher processing speed of supercomputers and mainframes has made the technology for high-density packaging extremely important. The authors have developed a new technology that permits us to connect multi-pin (487 pins) ultra-fast logic LSIs on a ceramic substrate with a fine pitch of 110 μm using TAB (Tape Automated Bonding). By developing new materials, bonding process, and manufacturing facilities, the authors were able to achieve a connection pitch finer than that which conventional technology can offer. As a result, they were able to develop an ultra-fine pitch, high-density, and high reliability packaging technology that allowed them to produce high-performance computer systems

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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