在太空中使用商用半导体技术

A. Johnston, C. Lee, B. Rax, D. Shaw
{"title":"在太空中使用商用半导体技术","authors":"A. Johnston, C. Lee, B. Rax, D. Shaw","doi":"10.1109/RADECS.1995.509774","DOIUrl":null,"url":null,"abstract":"New issues are discussed that must be considered when unhardened commercial technologies are used in space applications, as well as hardness assurance techniques. Large differences in dose-rate effects were observed for different circuit types from the same manufacturer, which may be due to differences in the thickness of isolation oxides used in processing. Data are presented for scaled MOS devices that show how total dose hardness and hard error rates are projected as devices are scaled to smaller feature size. Hard errors are expected to be a significant problem for devices with feature size below 0.6 /spl mu/m.","PeriodicalId":310087,"journal":{"name":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Using commercial semiconductor technologies in space\",\"authors\":\"A. Johnston, C. Lee, B. Rax, D. Shaw\",\"doi\":\"10.1109/RADECS.1995.509774\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New issues are discussed that must be considered when unhardened commercial technologies are used in space applications, as well as hardness assurance techniques. Large differences in dose-rate effects were observed for different circuit types from the same manufacturer, which may be due to differences in the thickness of isolation oxides used in processing. Data are presented for scaled MOS devices that show how total dose hardness and hard error rates are projected as devices are scaled to smaller feature size. Hard errors are expected to be a significant problem for devices with feature size below 0.6 /spl mu/m.\",\"PeriodicalId\":310087,\"journal\":{\"name\":\"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RADECS.1995.509774\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Third European Conference on Radiation and its Effects on Components and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RADECS.1995.509774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20

摘要

讨论了在空间应用中使用未经硬化的商业技术以及硬度保证技术时必须考虑的新问题。同一制造商生产的不同类型电路在剂量率效应方面存在很大差异,这可能是由于加工过程中使用的隔离氧化物的厚度不同。本文给出了缩放MOS器件的数据,显示了当器件缩放到更小的特征尺寸时,如何预测总剂量硬度和硬错误率。对于特征尺寸低于0.6 /spl mu/m的设备,硬错误预计是一个重大问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Using commercial semiconductor technologies in space
New issues are discussed that must be considered when unhardened commercial technologies are used in space applications, as well as hardness assurance techniques. Large differences in dose-rate effects were observed for different circuit types from the same manufacturer, which may be due to differences in the thickness of isolation oxides used in processing. Data are presented for scaled MOS devices that show how total dose hardness and hard error rates are projected as devices are scaled to smaller feature size. Hard errors are expected to be a significant problem for devices with feature size below 0.6 /spl mu/m.
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