22nm FDSOI源端DAC驱动器的阻抗校准技术、消除过程和温度变化

Hossein Ghafarian, H. Ordouei, F. Gerfers
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引用次数: 3

摘要

本文研究了在22nm FDSOI工艺中实现的10位源端接数模转换器(DAC)上应用的各种阻抗校准技术。体偏置和并联分支技术都利用了FDSOI技术的优点,利用了大后门电压调谐。为了验证所提出的技术,建立了SST驱动器的分析模型,并证明了每种技术的阻抗调谐范围涵盖了整个±3σ过程和-40℃至80℃的温度范围。事实证明,车身偏置技术只覆盖了三分之一的过程和温度变化,而平行分支则以增加功耗为代价,对所有角落进行校准。采用所提出的阻抗校准得到的完整SST驱动器的仿真结果满足汽车10GBase-T1以太网标准在±3σ过程角和-40℃至80℃温度范围内严格的回波损耗规范。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impedance Calibration Technique Canceling Process and Temperature Variation in Source Terminated DAC Drivers in 22nm FDSOI
This paper studies various impedance calibration techniques applied on a 10-bit source series terminated digital-to-analog converter (DAC) implemented in a 22nm FDSOI process. The body biasing and parallel branching technique, both take advantages of the FDSOI technology by using the large backgate voltage tuning. To verify the proposed technique, an analytical model of the SST driver is developed and the impedance tuning range of each technique is proven to cover over the full ±3σ process and –40 C to 80 C temperature range. It turns out, that the body biasing technique just covers one third of the process and temperature variations, whereas parallel branching calibrates for all corners at cost of increased power consumption. The obtained simulation results of the complete SST driver using the proposed impedance calibration meet the stringent return loss specifications of the automotive 10GBase-T1 Ethernet standard across ±3σ process corner and –40 C to 80 C temperature range.
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