{"title":"用于智能系统的III-V化合物半导体纳米技术","authors":"H. Hasegawa, S. Kasai","doi":"10.1109/ICMENS.2005.57","DOIUrl":null,"url":null,"abstract":"Presents and discusses a new smart chip called an \"intelligent quantum (IQ) chip\". III-V semiconductor chips with sizes of millimeter square and memories are integrated on chip with capabilities of wireless communication, wireless power supply and various sensing functions. It is an attempt to endow \"more intelligence\" than simple identification (ID) like in RFID chips to semiconductor chips. A key issue to realize IQ chips is the power consumption of processor/memory parts which increases as one tries to endow more intelligence. The power density of the current Si CMOS technology is too high. Thus, use of quantum devices should lead to large reduction of power density.","PeriodicalId":185824,"journal":{"name":"2005 International Conference on MEMS,NANO and Smart Systems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"III-V compound semiconductor nanotechnology for smart systems\",\"authors\":\"H. Hasegawa, S. Kasai\",\"doi\":\"10.1109/ICMENS.2005.57\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Presents and discusses a new smart chip called an \\\"intelligent quantum (IQ) chip\\\". III-V semiconductor chips with sizes of millimeter square and memories are integrated on chip with capabilities of wireless communication, wireless power supply and various sensing functions. It is an attempt to endow \\\"more intelligence\\\" than simple identification (ID) like in RFID chips to semiconductor chips. A key issue to realize IQ chips is the power consumption of processor/memory parts which increases as one tries to endow more intelligence. The power density of the current Si CMOS technology is too high. Thus, use of quantum devices should lead to large reduction of power density.\",\"PeriodicalId\":185824,\"journal\":{\"name\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-07-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMENS.2005.57\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Conference on MEMS,NANO and Smart Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMENS.2005.57","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
III-V compound semiconductor nanotechnology for smart systems
Presents and discusses a new smart chip called an "intelligent quantum (IQ) chip". III-V semiconductor chips with sizes of millimeter square and memories are integrated on chip with capabilities of wireless communication, wireless power supply and various sensing functions. It is an attempt to endow "more intelligence" than simple identification (ID) like in RFID chips to semiconductor chips. A key issue to realize IQ chips is the power consumption of processor/memory parts which increases as one tries to endow more intelligence. The power density of the current Si CMOS technology is too high. Thus, use of quantum devices should lead to large reduction of power density.
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