皮秒激光ITO图像化

G. Račiukaitis, M. Brikas, M. Gedvilas, G. Darcianovas
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摘要

氧化铟锡(ITO)是制造电子器件和平板显示器透明电极的主要材料。激光直写技术已广泛应用于ITO的图案化。定义良好的边缘和良好的电气隔离在短的分离是需要高包装密度的现代OLED和RFID设备。具有短皮秒脉冲宽度的高重复率激光器为玻璃和其他基板上透明导体的高效结构提供了新的可能性。本文介绍了不同波长皮秒激光在玻璃上刻蚀ITO薄膜的结果。激光辐射引起材料的烧蚀,在ITO中形成沟槽。采用相衬光学显微镜、触笔型轮廓仪、扫描电镜和原子力显微镜对沟槽进行了分析。当激光辐照强度为266 nm时,达到了0.20 J/cm2以上的阈值,而当激光辐照强度为355nm时,阈值更高,达到了0.46 J/cm2以上。当影响度大于1.55 J/cm2时,玻璃基板被破坏。532纳米的辐射可以得到清晰的沟槽,但表面上产生了大量灰尘形式的残留物。266nm的紫外辐射为ITO烧蚀提供了最宽的工作窗口,而不会损坏衬底。使用接近烧蚀阈值的紫外激光辐射,可以最大限度地减少表面污染和过程中重铸脊的形成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Patterning of ITO with picosecond lasers
Indium-tin oxide (ITO) is the main material for making transparent electrodes in electronic devices and flat panel displays. Laser-direct-write technology has been widely used for patterning ITO. The well defined edges and good electrical isolation at a short separation are required for the modern OLED and RFID devices of high packing density. High repetition rate lasers with a short, picosecond pulse width offer new possibilities for high efficiency structuring of transparent conductors on glass and other substrates. The results of patterning the ITO film on glass with picosecond lasers at various wavelengths are presented. Laser radiation initiated ablation of the material, forming trenches in ITO. Profile of the trenches was analyzed with a phase contrast optical microscope, a stylus type profiler, SEM and AFM. Clean removal of the ITO layer was achieved with the 266 nm radiation when laser fluence was above the threshold at 0.20 J/cm2, while for the 355 nm radiation the threshold was higher, above 0.46 J/cm2. The glass substrate was damaged in the area where the fluence was higher than 1.55 J/cm2. The 532 nm radiation allowed getting well defined trenches, but a lot of residues in the form of dust were generated on the surface. UV radiation at the 266 nm provided the widest working window for ITO ablation without damage of the substrate. Use of UV laser radiation with fluences close to the ablation threshold made it possible to minimize surface contamination and the recast ridge formation during the process.
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