22FDX®辐射强化测试芯片对TID和SEE的响应

2021 IEEE Nuclear and Space Radiation Effects Conference (NSREC) Pub Date : 2021-07-01 DOI:10.1109/NSREC45046.2021.9679324

William Rice, Marlon Marquez, Tejinder Jaswal, Salvatore Caruso, Armando Rivera Gil

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引用次数: 0

摘要

研究了基于Global Foundries 22FDX®技术的定制测试芯片对TID和SEE环境的响应。虽然该技术在第一个设计中的性能测量结果与之前的一些测试结果吻合良好，但使用第二个定制的辐射硬化设计表明，移位寄存器测试结构的每比特横截面显著提高了6倍。

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Response of a 22FDX® Radiation-Hardened-by-Design Test Chip to TID and SEE

A custom-designed test chip built on Global Foundries 22FDX® technology was investigated for its response to TID and SEE environments. While measurements of the performance for the technology in a first design match well with some reported results from prior testing, the use of a second custom radiation-hardened design demonstrated a significant 6x improvement in the per-bit cross section for a shift register test structure.

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2021 IEEE Nuclear and Space Radiation Effects Conference (NSREC)

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