功率放大器可靠性优化的联合仿真方法

2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC) Pub Date : 2018-06-01 DOI:10.1109/EDSSC.2018.8487110

Yuanbo Ma, Bin Li, Zhaohui Wu, Haigang Wu, Zhijian Chen

{"title":"功率放大器可靠性优化的联合仿真方法","authors":"Yuanbo Ma, Bin Li, Zhaohui Wu, Haigang Wu, Zhijian Chen","doi":"10.1109/EDSSC.2018.8487110","DOIUrl":null,"url":null,"abstract":"An optimized design method for the reliability of power amplifier, based on the electric and thermal co-simulation is proposed. Different from traditional methods focused on device performance and separated from electrical parameters, it can build up a closed-loop feedback between temperature distribution of multi-heat source and the distortion of electrical parameters varied with temperature. Certified by the experimental results of CMOS and GaAs HBT process power amplifiers, the reliability can be optimized with minimizing area cost after several iterations.","PeriodicalId":279745,"journal":{"name":"2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Co-simulation Method of Power Amplifier for Reliability Optimization\",\"authors\":\"Yuanbo Ma, Bin Li, Zhaohui Wu, Haigang Wu, Zhijian Chen\",\"doi\":\"10.1109/EDSSC.2018.8487110\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An optimized design method for the reliability of power amplifier, based on the electric and thermal co-simulation is proposed. Different from traditional methods focused on device performance and separated from electrical parameters, it can build up a closed-loop feedback between temperature distribution of multi-heat source and the distortion of electrical parameters varied with temperature. Certified by the experimental results of CMOS and GaAs HBT process power amplifiers, the reliability can be optimized with minimizing area cost after several iterations.\",\"PeriodicalId\":279745,\"journal\":{\"name\":\"2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDSSC.2018.8487110\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2018.8487110","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

提出了一种基于电学和热学联合仿真的功率放大器可靠性优化设计方法。与传统的以器件性能为中心，与电气参数分离的方法不同，该方法可以在多热源的温度分布与电气参数随温度变化的畸变之间建立闭环反馈。通过CMOS和GaAs HBT工艺功率放大器的实验结果证明，经过多次迭代，可以在面积成本最小的情况下优化可靠性。

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A Co-simulation Method of Power Amplifier for Reliability Optimization

An optimized design method for the reliability of power amplifier, based on the electric and thermal co-simulation is proposed. Different from traditional methods focused on device performance and separated from electrical parameters, it can build up a closed-loop feedback between temperature distribution of multi-heat source and the distortion of electrical parameters varied with temperature. Certified by the experimental results of CMOS and GaAs HBT process power amplifiers, the reliability can be optimized with minimizing area cost after several iterations.

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来源期刊

2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)

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